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NANO IMPRINTER

在LED、OLED、LCD、BIO等多个领域，NANO PATTERN的必要性正在增加。但除半导体产业外，引进Photo Lithography设备（KrF、ArF）制造Nano Pattern，在装置价格、品质、生产性方面都不合适。Gigalain数年间开发了Imprinter技术并进一步尖端化，提供从Master Mold到生产Mold的制作及工程wafer上imprint进行全自动执行的产品服务。另外，在自身清洁室进行品质管理下，委托生产Mold的制作及wafer imprint工程，不仅提供高品质产品，还提供高生产性产品。
Features
  • 自动化设备运用

    - 世界首个wafer scale full automated imprinting process wafer load/unload，coating，imprinting工程自动化

    - 通过实现自动化确保批量生产：error最小化及污染最小化

  • 实现 Low CoC/CoO

    - 通过可重复使用的mold节约CoC

    - 与Stepper相比，throughput的投资费用较低及维护费用显见（CoO）

  • 真空UV imprint工艺

    - 从数十nm级超微模式到um级超微模式实现

    - 在hole、pillar、wall、trench等大部分模式中防止air void不良及确保高模式复制率

    - 拥有3D lens、lenticular等一般photo工艺无法实现的图案的轻松生产能力

    - 多种基板的可适用性（glass,、wafer、film）

    -
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    - 世界最高水平的精密残膜控制能力：实现wafer scale均匀残膜并确保再现性

提供多种 model line up
Imprinting
Process
设备组件
Full Automated
Imprinter
Mold
Imprinter
Auto
Imprinter
Manual
Imprinter
NANO-IMPRINTER CITUS 6000FA
Fully automatic Imprinter
Overview
&
Performance
  • - 4" ~ 12" wafer imprinting(cassette loading)
  • - Sub-100nm pattern resolution (Comparable with KrF scanner)
  • - Fully automatic operation : Master mold → mold → imprint, no operator intervention
  • - System integration, CITUS6000M(mold imprinter) + 6000R(wafer imprinter), in-line operation
  • - Easy job change(flexible pattern change while operation)
    various master wafers can be loaded without any delay or loss during master change
  • - Master mold loading : 12" ~ 8" wafer(cassette loading)
  • - Motion monitoring system : Coating, imprinting, wafer delivery, film moving, on-line CAM record
  • - Resin mold repeatable (multiple usage) : Gaseous release coater in-line
  • - Lower CoC & CoO : cost of consumable, cost of ownership
  • - Very small footprint & simple process against photo stepper & wet(coating, developing)
  • - Display, WLO, LED, WGP, AR Devices
    PSS, Micro Lens Array, 3D structure, slanted structure and nano~micro scale patterning
  • - Normal monthly capacity : 30K/month, 40~60 wph(wafer per hour)
NANO-IMPRINTER CITUS 6000M for Mold CITUS 6000R CITUS 6000SA CITUS 8300R
Mold Imprinter Auto Imprinter Manual Imprinter Alignment Imprinter
Overview
  • - Master mold : 6inch ~ 12inch
  • - Resin mold roll production
  • - In-line Resin Coating
    (spray, ink jet, u-dispenser)
  • - Roll to Plate Contact imprint
  • - UV imprint(365nm)
  • - 4inch ~ 8inch
  • - LED, Display, Optical Devices
  • - Flexible Resin Mold(Roll to Roll)
  • - In-line Coater(spin coater)
  • - In-line Gaseous release treatment
  • - Vacuum assisted UV imprint(365nm)
  • - 4inch ~ 6inch, Manual type
  • - LED, Display, Optical Devices
  • - Flexible Resin Mold
  • - Coater/Demold optional
  • - Vacuum assisted UV imprint(365nm)
  • - Roll to plate UV imprint(365nm)
  • - R t P Imprinter with alignment function
  • - 4inch ~ 12inch, 300 by 300
  • - Flexible Mold
  • - TSA / BSA
  • - UVW moving stage : X, Y, θ aligning
  • - Alignment : ± 5 um ( @ 12" wafer )
Performance
  • - 50nm Pattern Resolution
  • - Lower CoC & CoO
  • - Monthly Capa. : 30K
  • - Direct mold fabrication from
    master mold
  • - 50nm Pattern Resolution
  • - Lower CoC & CoO
  • - Small footprint against photo Lithography
  • - Comparable to KrF, i-line Stepper
  • - Monthly Capa. : 30K
  • - 50nm Pattern Resolution
  • - Long life time sheet type mold
  • - Easy loading / unloading
  • - Easy job Change(Mold change)
  • - R&D for WGP, nPSS, Fine nano pattern
  • - Spin coater integration (option)
  • - TSA/BSA : Top side align + Bottom side align, two vision systems
  • - Roll to Plate imprint & UVW stage moving
  • - Working mold & alignment imprint :
    Flexible mold, Without position moving of mold film
  • - Full field imprint : wafer scale mark align ( ~12" )
Process Data
Nano pattern :
WGP
Nano pattern :
pillar array
Micro pattern :
hole array
Micro lens array :
Si wafer
Micro trench line
Various imprinted
patterns
Meta lens array
Slanted grating